Semiconductor environments demand sub-micron precision and contamination-sensitive handling. AMS has engineered custom automation for these applications, where the margin between a working system and a scrapped part is measured in microns.
A global semiconductor manufacturer needed one machine to process both 200mm and 300mm wafers without a changeover, on locally supportable control platforms. AMS engineered a custom pre-aligner and end-of-arm tooling spanning the full range, and the resulting platform is now the customer’s new standard specification.
A machine builder needed to inspect silicon wafers for inkjet cartridge production at 100-nanometer resolution, with no existing way to control the motion. AMS engineered the complete motion control system, and the resulting design became the basis for a product line deployed worldwide.